SUBFLOOR & DECK ADHESVE 28 O

SUBFLOOR & DECK ADHESVE 28 O

Item # BB 101564

  • Ideal for bonding common building materials, including plywood, wafer board, particle board, and lumber
  • Provides the ability to gun in temperatures as low as 22 and as high as 120 with no running or dripping
  • Formulated to increase structural integrity of wall, deck and subfloor systems
  • Special bond prevents floors from squeaking
Manufacturers Item #LNP-902

Liquid Nails Subfloor and Deck Construction Adhesive is a VOC-compliant, low temperature and high temperature adhesive for exterior and interior uses. It is specially formulated to for extreme conditions, offering easy cold-weather gunning, bonding with wet, frozen and treated lumber, and low splatter and dripping in high heat. This high-performance adhesive is ideal for bonding common building materials to concrete, bridging gaps up to 3/8 in.
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